●W.C. Lin, Y.S. Li, Albert T Wu*.“Study of diffusion barrier for solder/n-Type Bi2Te3 and bonding strength for p- and n-type thermoelectric modules”, Journal of Electronic Materials, 47(1), 148-154. (2018)

●B.C. Lin, C.S. Ku, H.Y. Lee, S. Chakroborty, Albert T. Wu* “Analysis of arrayed nanocapacitor formed on nanorods by flow-rate interruption atomic layer deposition”, Applied Surface Science, 426, 224-228. (2017)

●C.H. Chen, S. Chakroborty, B.H. Lee, H.C. Chen, C.M. Wang, Albert T. Wu* “Assessment of microstructure and shear strength for low melting point tin-free alloys on Cu”, Materials Science and Engineering: A, 708, 142-148.(2017)

●H.C. Hsieh, C.H. Wang, W.C. Lin, S. Chakroborty, T.H. Lee, H.S. Chu, Albert T. Wu*. “Electroless Co-P diffusion barrier for n-PbTe thermoelectric material”, Journal of Alloys and Compounds, 728, 1023-1029 (2017)

●Y.T. Huang, C.H. Chen, S. Chakroborty, Albert T. Wu* “Crystallographic orientation effect on electromigration in Ni-Sn microbump”, JOM, 69(9) 1717-1723. (2017)

●B.C. Lin, C.S. Ku, H.Y. Lee, Albert T. Wu* “Epitaxial growth of ZnO nanorod arrays via a self-assembled microspheres lithography ”, Applied Surface Science, 414, 212-217. (2017)

●P.C. Lin, H. Chen, H.C. Hsieh, Albert T. Wu* “Effect of phase separation on mechanical strength of co-sputtering Cu(Ti) thin film in chip-level 3DIC bonding”, Materials Letters, 189, 93-96. (2017)

●Y.T. Huang, C.H. Chen, B.H.  Lee, H.C. Chen, C.M. Wang, Albert T. Wu* “In situ electromigration in Cu-Sn and Ni-Sn critical solder length for three-dimensional integrated circuits”, Journal of Electronic Materials, 45(12), 6163-6170. (2016)

●Y.T. Ouyang, H.C. Hsieh, P.C. Lin, T.H. Tseng, C.S. Ku, H.Y. Lee, Albert T. Wu* “Si1-xGex photodiode with segregated Ge nanocrystals”, Materials Letters, 184, 308-311. (2016)

●H. Chen, Y.L. Tsai, Y.T. Chang, Albert T. Wu* “Effect of massive spalling on mechanical strength of solder joints in Pb-free solder reflowed on Co-based surface finishes”, Journal of Alloys and Compounds, 671, 100-108. (2016)

●H. Chen, H.Y. Lee, C.S. Ku, Albert T. Wu* “Evolution of residual stress and qualitative analysis of Sn whiskers with various microstructures”, Journal of Materials Science, 51(7), 3600-3606. (2016)

●H.C. Huang*, K.L. Lin, Albert T. Wu “Disruption of crystalline structure of Sn3.5Ag induced by electric current”, Journal of Applied Physics, 119(11), 115102. (2016)

●C.H. Chen, B.H. Lee, H.C. Chen, C.M. Wang, Albert T. Wu * “Interfacial reactions of low-melting Sn-Bi-Ga solder alloy on Cu substrate”, Journal of Electronic Materials, 45(1), 197-202. (2016)

●Y.H. Liao, C.L. Liang, K.L. Lin*, Albert T. Wu “High dislocation density of tin induced by electric current”, AIP Advances, 5, 127210. (2015)

●Yao-Tsung Ouyang, Chien-Hao Su, Jenq-Yang Chang , Shao-Liang Cheng, Po-Che Lin, Albert T. Wu* “Metastable Ge nanocrystalline in SiGe matrix for photodiode”, Appl. Surf. Sci., 349, 387 (2015)

●He Jian-Yang, Lin Kwang-Lung, Albert T. Wu. “The diminishing of crystal structure of Sn9Zn alloy due to electrical current stressing”, J. Alloys. and Compd., 619, 372 (2015)

●Su Chien-Hao, Chen Hao, Lee Hsin-Yi, Liu, Cheng Yi, Ku Ching-Shun, Albert T. Wu*.“Kinetic Analysis of Spontaneous Whisker Growth on Pre-treated Surfaces with Weak Oxide”, J. Electron. Mater., 43, 3290 (2014)

●Y.T. Huang, H.H. Hsu, Albert T. Wu*, “Electromigration-induced back stress in critical solder length for three-dimensional integrated circuits”, J. Appl. Phys., 115, 034904 (2014)

●C.Y. Liu*, Y.C. Hsu, Y.J. Hu, T.S. Huang, C.T. Lu, Albert T. Wu, “Back-Fill Sn Flux against Current-Stressing at Cathode Micro Cu/Sn Interface”, SSL., 3, 17 (2014)

●Y.J. Hu, Y.C. Hsu, T.S. Huang, C.T. Lu, Albert T. Wu, C.Y. Liu*, “Effect of Metal Bond-Pad Configurations on the Solder Microstructure Development of Flip-Chip Solder Joints”, J. Electron. Mater., 43, 170 (2014)

●Hsueh-Hsien Hsu, Tz-Cheng Chiu,  Tao-Chih Chang, Shin-Yi Huang,  Hsin-Yi Lee,  Ching-Shun Ku, Yang-Yi Lin,  Chien-Hao Su,  Li-Wei Chou,  Yao-Tsung Ouyang, Yi-Ting Huang,Albert T. Wu*, “Evaluation of Strain Measurement in a Die-to-Interposer Chip Using In Situ Synchrotron X-ray Diffraction and Finite-Element”, J. Electron. Mater., 43, 52 (2014)

●P.Y. Chien, C.H. Yeh, Albert T. Wu*, “Polarity effect in SAC305/bismuth telluride thermoelectric system”, J. Electron. Mater., 43, 284 (2014)

●Kao, C. Robert, Wu, Albert T. Wu, Tu, King-Ning, Lai, Yi-Shao, “Reliability of micro-interconnects in 3D IC packages”, Microelectonics Reliability., 53, 1-1 (2013)

●J.H. Hong, H.Y. Lee, Albert T. Wu*, “Massive Spalling and Morphological Change of Intermetallic Compound Affected by Adding Pd in Co-based Surface Finishes”, J. Alloys and Compd., 580, 195 (2013)

●Li-Wei Chou, Yang-Yi Lin, Albert T. Wu*, “High Surface Textured SnO2 Hybrid Thin Films Fabricated Using the Zozzle-spraying Process for Solar Cell Applications”, Appl. Surf. Sci., 277, 30 (2013)

●Yang-Yi Lin, Hsin-Yi Lee, Ching-Shun Ku, Li-Wei Chou, and Albert T. Wu*, “Bandgap Narrowing in High Dopant Tin Oxide Degenerate Thin Film Produced by Atmosphere Pressure Vapor Deposition”, Appl. Phys. Lett., 102, 11 (2013)

●Wei-Yu Chen,Tsung-Chieh Chiu ,Kwang-Lung Lin, Albert T. Wu, Wei-Luen Jang, Chung-Li Dong, Hsin-Yi Lee, “Anisotropic Dissolution behavior of the Second Phase in SnCu Solder Alloys under Current Stress”, Scripta Mater., 68, 317 (2013)

●Ying-Ta Chiu, Kwang-Lung Lin, Albert T. Wu, Wei-Luen Jang, Chung-Li Dong, Yi-Shao Laid, “Electrorecrystallization of Metal Alloy”, J. Alloys and Compd., 549, 190 (2013)

●Li-Chen Lo, Albert T. Wu*, “Interfacial Reactions Between Diffusion Barriers and Thermoelectric Materials Under Current Stressing”, J. Electron. Mater., 41, 3325 (2012)

●Chang-Yen Ko, Albert T. Wu*, “Evaluation of Diffusion Barrier Between Pure Sn and Te”, J. Electron. Mater., 41, 3320 (2012)

●Yang-Yi Lin, Albert T. Wu*, Ching-Shun Ku, and Hsin-Yi Lee, “Analysis of Chlorine Ions in Antimony-Doped Tin Oxide Thin Film Using Synchrotron Grazing Incidence X-ray Diffraction ”, Jpn. J. Appl. Phys., 51, 10 (2012)

●C.Y. Tsai, B.Y. Lou, H.H. Hsu, Albert T. Wu*, “Current Redistribution by Intermetallic Compounds in Through-Silicon-Via (TSV)”, Mater. Chem. Phys., 132, 162 (2012)

●T.Y. Lin, C.N. Liao, Albert T. Wu*, “Evaluation of Diffusion Barrier Between Lead-Free Solder Systems and Thermoelectric Materials”, J. Electron. Mater., 41 , 153 (2012)

●Chao-Nan Yeh, Kewin Yang, Hsin-Yi Lee and Albert T. Wu*, “Elucidating the Metal-Induced Crystallization and Diffusion Behavior of Al/a-Ge Thin Films”, J. Electron. Mater., 41 , 159 (2012)

●Hsueh-Hsien Hsu, Shin-Yi Huang, Tao-Chih Chang, and Albert T. Wu*, “Nucleation and Propagation of Voids in Microbumps for 3 Dimensional Integrated Circuits”, Appl. Phys. Lett.,99, 25 (2011)

●Chien-Hao Su, Hao Chen, Hsin-Yi Lee, and Albert T. Wu*, “Controlled Positions and Kinetic Analysis of Spontaneous Tin Whisker Growth”, Appl. Phys. Lett., 99 , 13 (2011)

●Chien-Hung Chen, Shiao-Yi Li, Anthony S.T. Chiang*, Albert T. Wu and Y.S.Sun, “Scratch-resistant Zeolite Anti-reflective Coating on Glass for Solar Applications”, Sol. Energy Mater. Sol. Cells, 95, 7 (2011)

●J. O. Suh, K. N. Tu, Albert T. Wu* and N. Tamura, “Preferred Orientation Relationships with Large Misfit Interfaces between Ni3Sn4 and Ni in Reactive Wetting of Eutectic SnPb on Ni”, J. Appl. Phys., 109, 12 (2011)

●Albert T. Wu*, C. N. Siao, C. S. Ku and H. Y. Lee, “In Situ Observation of Stress Evolution in Pure Tin Strip under Electromigration Using Synchrotron Radiation x-ray”, J. Mater. Res., 25, 292 (2010)

●Y.Y. Chiang, R. Cheng, Albert T. Wu*, “Effects on Undercooling and Interfacial Reactions with Cu Substrates of Adding Bi and In to Sn-3Ag Solder ”, J. Electron. Mater., 39, 2397 (2010)

●Albert T. Wu*, C. Y. Tsai, C. L. Kao, M. K. Shih, Y. S. Lai, H. Y. Lee and C. S. Ku, “In Situ Measurements of Thermal and Electrical Effects of Strain in Flip-Chip Silicon Dies Using Synchrotron Radiation X-rays”, J. Electron. Mater., 38, 2308 (2009)

●Albert T. Wu* and K. H. Sun, “Determination of Average Failure Time and Microstructural Analysis of Sn-Ag-Bi-In Solder Under Electromigration”, J. Electron. Mater., 38, 2780 (2009)

●Albert T. Wu* and Y. C. Ding, “The suppression of Tin Whisker Growth by the Coating of Tin Oxide Nano Particles and Surface Treatment”, Microelectron. Reliab., 49, 318 (2009)

●Albert T. Wu*, Ming-Hsun Chen and Ciou-Nan Siao, “The Effects of Solid State Aging on the Intermetallic Compounds of SnAgBiIn Solders on Cu Substrates” J. Electron. Mater., 38, 252 (2009)

●Albert T. Wu*, Ming-Hsun Chen and Che-Hsun Huang, “Kinetic Analysis of Interfacial Reaction in Sn-Ag-Bi-In systems on Cu Substrates” J. Alloys. and Compd., 476, 436 (2009)

●W.H. Lin, Albert T. Wu*, S.Z. Lin, T.H. Chuang, and K.N. Tu, “Electromigration of Flip Chip Solder Joint of Sn-8Zn-3Bi on Copper Pads” J. Electron. Mater., 36, 753 (2007)

●Albert T. Wu*, and F. Hua, “Interfacial Stability of Eutectic SnPb Solder and Composite 60Pb40Sn Solder on Cu/Ni(V)/Ti under Bump Metallization”, J. Mater. Res., 22, 735 (2007)

●K. N. Tu, Chih Chen and Albert T. Wu*, “Stress Analysis of Spontaneous Sn Whisker Growth”, J. Mater. Sci. - Mater. Electron. 18, 269 (2007)

●K. N. Tu, J. O. Suh, Albert T. Wu*, N. Tamura, and C. H. Tung, “Mechanism and Prevention of Spontaneous tin whisker Growth”, Invited paper in Mater. Trans. 46, 11 (2005)

●Albert T. Wu, A. M. Gusak, and K.N. Tu*, and C. R. Kao, “Electromigration Induced Grain Rotation in Anisotropic Conducting beta-Tin” Appl. Phys. Lett., 86, 241902 (2005)

●Albert T. Wu, K. N. Tu*, J. R. Lloyd, N. Tamura, B. C. Valek, and C. R. Kao, “The Study of Microstructure Evolution of Tin Grains Due to Electromigration by Using Synchrotron X-ray Microdiffraction”, TMS Lett., 1, 165 (2004)

●Albert T. Wu, K. N. Tu*, J. R. Lloyd, N. Tamura, B. C. Valek, and C. R. Kao, “Electromigration-induced Microstructure Evolution in Tin Studied by Synchrotron X-ray Microdiffraction”, Appl. Phys. Lett., 85, 2490 (2004)